Hybrid Semiconductor Process Engineer – Chip Design

Über das Unternehmen

Infineon Technologies AG is a world leader in semiconductor solutions that make life easier, safer, and greener. We are at the forefront of innovation, developing microelectronics that connect the real and the digital world. With a strong commitment to R&D and sustainability, Infineon enables groundbreaking advancements in automotive, industrial, consumer, and communication applications. Join our team in Osnabrück and contribute to shaping the future of technology.

Stellenbeschreibung

We are seeking a highly motivated and skilled Hybrid Semiconductor Process Engineer to join our Chip Design team in Osnabrück. This role involves working on advanced semiconductor manufacturing processes, with a particular focus on process integration and optimization for novel chip designs. You will play a crucial part in bridging the gap between design and fabrication, ensuring our innovative chip architectures can be reliably and efficiently manufactured. This is a hybrid role, combining on-site lab work and collaborative efforts with flexible remote work options.

Hauptverantwortlichkeiten

• Develop, optimize, and characterize semiconductor manufacturing processes for advanced chip designs.
• Collaborate closely with chip designers to ensure manufacturability and performance targets are met.
• Perform process integration, material characterization, and device electrical testing.
• Utilize statistical process control (SPC) and design of experiments (DOE) methodologies for process improvement.
• Troubleshoot process issues and implement corrective actions to enhance yield and reliability.
• Document process flows, experimental results, and provide technical reports.
• Stay abreast of the latest developments in semiconductor processing and materials science.

Erforderliche Fähigkeiten

• Bachelor's or Master's degree in Electrical Engineering, Materials Science, Physics, or a related field.
• Minimum 4 years of experience in semiconductor process engineering or R&D.
• Strong understanding of semiconductor device physics and fabrication processes (e.g., lithography, etching, deposition, implantation).
• Experience with cleanroom protocols and semiconductor equipment.
• Proficiency in data analysis and statistical tools.
• Excellent problem-solving skills and attention to detail.
• Ability to work effectively in a collaborative, interdisciplinary team environment.

Bevorzugte Qualifikationen

• Ph.D. in a relevant engineering or science discipline.
• Experience with advanced process nodes (e.g., 28nm and below).
• Familiarity with TCAD (Technology Computer-Aided Design) tools.
• Knowledge of chip packaging and assembly processes.
• Experience in automotive or power electronics semiconductor manufacturing.

Vorteile & Zusatzleistungen

• Competitive salary and performance-based bonuses.
• Comprehensive health, dental, and vision insurance.
• Generous paid time off and holidays.
• Company-sponsored pension scheme.
• Opportunities for professional development and career growth.
• Flexible hybrid work model.
• Access to cutting-edge technology and a collaborative work environment.
• Employee assistance programs.
• On-site facilities (e.g., cafeteria, fitness center).

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